Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10407604 | Heat-dissipating resin composition, and component and electronic device including the same | HONAMI NAWA, HIROHISA HINO, Arata Kishi, Naomichi Ohashi, Yasuhiro Suzuki | 2019-09-10 |