Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10510590 | Low resistivity films containing molybdenum | Shruti Vivek Thombare, Michal Danek, Chiukin Steven Lai, Joshua Collins, Hanna Bamnolker +3 more | 2019-12-17 |
| 10438847 | Manganese barrier and adhesion layers for cobalt | Chiukin Steven Lai, Jeong-Seok Na, Michal Danek, Kaihan Ashtiani | 2019-10-08 |
| 10283404 | Selective deposition of WCN barrier/adhesion layer for interconnect | Jeong-Seok Na, Megha Rathod, Chiukin Steven Lai | 2019-05-07 |
| 10256142 | Tungsten feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Michal Danek, Juwen Gao, Deqi Wang | 2019-04-09 |
| 10242879 | Methods and apparatus for forming smooth and conformal cobalt film by atomic layer deposition | Jeong-Seok Na | 2019-03-26 |
| 10229826 | Systems and methods for forming low resistivity metal contacts and interconnects by reducing and removing metallic oxide | Raihan M. Tarafdar, Shruti Vivek Thombare, Jeong-Seok Na, Chiukin Steven Lai | 2019-03-12 |
| 10170320 | Feature fill with multi-stage nucleation inhibition | Deqi Wang, Anand Chandrashekar, Michal Danek | 2019-01-01 |