Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497663 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Teruo Haibara, Tomohiro Uno | 2019-12-03 |
| 10468370 | Bonding wire for semiconductor device | Takashi Yamada, Ryo OISHI, Tomohiro Uno | 2019-11-05 |
| 10414002 | Bonding wire for semiconductor device | Takashi Yamada, Teruo Haibara, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno | 2019-09-17 |
| 10381320 | Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium | Tetsuya OYAMADA, Tomohiro Uno, Hiroyuki Deai | 2019-08-13 |
| 10236272 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Teruo Haibara, Tomohiro Uno | 2019-03-19 |