Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468370 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Tomohiro Uno | 2019-11-05 |
| 10414002 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Teruo Haibara, Kazuyuki Saito, Tomohiro Uno | 2019-09-17 |