Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497663 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Daizo Oda, Tomohiro Uno | 2019-12-03 |
| 10414002 | Bonding wire for semiconductor device | Takashi Yamada, Daizo Oda, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno | 2019-09-17 |
| 10236272 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Daizo Oda, Tomohiro Uno | 2019-03-19 |