Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381320 | Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium | Tetsuya OYAMADA, Tomohiro Uno, Daizo Oda | 2019-08-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10381320 | Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium | Tetsuya OYAMADA, Tomohiro Uno, Daizo Oda | 2019-08-13 |