Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515821 | Method of achieving high selectivity for high aspect ratio dielectric etch | Takumi Yanagawa | 2019-12-24 |
| 10504744 | Three or more states for achieving high aspect ratio dielectric etch | Takumi Yanagawa, Ranadeep Bhowmick, Eric A. Hudson, Felix Kozakevich, John Holland +2 more | 2019-12-10 |
| 10297459 | Technique to deposit sidewall passivation for high aspect ratio cylinder etch | Eric A. Hudson | 2019-05-21 |
| 10170324 | Technique to tune sidewall passivation deposition conformality for high aspect ratio cylinder etch | Eric A. Hudson, George Matamis | 2019-01-01 |