Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446518 | Sinterable bonding material and semiconductor device using the same | Hajime Inoue | 2019-10-15 |
| D845147 | Pouch container | Masahiro Kaminaga | 2019-04-09 |
| 10242923 | Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages | Jie Bai, Qiaohong Huang, Hong Jiang, Youko Murata, Yusuke Horiguchi +1 more | 2019-03-26 |
| D843847 | Pouch container | Masahiro Kaminaga | 2019-03-26 |