Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10242923 | Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages | Jie Bai, Qiaohong Huang, Hong Jiang, Yusuke Horiguchi, YounSang Kim +1 more | 2019-03-26 |