Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10287442 | Electrically conductive polymeric compositions, contacts, assemblies, and methods | Aziz S. Shaikh | 2019-05-14 |
| 10283378 | Fluxing underfill compositions | — | 2019-05-07 |
| 10242923 | Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages | Jie Bai, Qiaohong Huang, Youko Murata, Yusuke Horiguchi, YounSang Kim +1 more | 2019-03-26 |