Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10519343 | Pre-applied underfill film containing nano-particulate filler for 3DIC applications, compositions useful for the preparation thereof, and uses thereof | — | 2019-12-31 |
| 10242923 | Formulations containing mixed resin systems and the use thereof for wafer-level underfill for 3D TSV packages | Jie Bai, Hong Jiang, Youko Murata, Yusuke Horiguchi, YounSang Kim +1 more | 2019-03-26 |