Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10464291 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Hajime Momoi, Toshiyuki Ono, Hideta Arai, Ryo Fukuchi, Atsushi Miki | 2019-11-05 |
| 10194534 | Printed wiring board, electronic device, catheter, and metallic material | Hideta Arai, Atsushi Miki | 2019-01-29 |