Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10464291 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Satoru Morioka, Toshiyuki Ono, Hideta Arai, Ryo Fukuchi, Atsushi Miki | 2019-11-05 |