Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10472728 | Copper foil for printed circuit | Hideta Arai | 2019-11-12 |
| 10476391 | Voltage converting device | — | 2019-11-12 |
| 10464291 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Hajime Momoi, Satoru Morioka, Toshiyuki Ono, Hideta Arai, Ryo Fukuchi | 2019-11-05 |
| 10383222 | Surface-treated copper foil | Ryo Fukuchi, Hideta Arai | 2019-08-13 |
| 10194534 | Printed wiring board, electronic device, catheter, and metallic material | Hideta Arai, Satoru Morioka | 2019-01-29 |
| D837685 | Eyelet | — | 2019-01-08 |