Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10464291 | Copper heat dissipation material, carrier-attached copper foil, connector, terminal, laminate, shield material, printed-wiring board, metal processed member, electronic device and method for manufacturing the printed wiring board | Hajime Momoi, Satoru Morioka, Toshiyuki Ono, Hideta Arai, Atsushi Miki | 2019-11-05 |
| 10448507 | Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna | — | 2019-10-15 |
| 10383222 | Surface-treated copper foil | Atsushi Miki, Hideta Arai | 2019-08-13 |