Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418341 | Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant | JinHee Jung, InSang Yoon | 2019-09-17 |
| 10388637 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, HunTeak Lee, InSang Yoon, Il Kwon Shim | 2019-08-20 |