Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418341 | Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant | JinHee Jung, OhHan Kim | 2019-09-17 |
| 10388637 | Semiconductor device and method of forming a 3D interposer system-in-package module | OhHan Kim, DeokKyung Yang, HunTeak Lee, Il Kwon Shim | 2019-08-20 |
| 10319684 | Dummy conductive structures for EMI shielding | SeungYong Chai, Soyeon Park | 2019-06-11 |