Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468384 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | DeokKyung Yang, Sungsoo Kim, HeeSoo Lee | 2019-11-05 |
| 10388637 | Semiconductor device and method of forming a 3D interposer system-in-package module | OhHan Kim, DeokKyung Yang, InSang Yoon, Il Kwon Shim | 2019-08-20 |