Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10418341 | Semiconductor device and method of forming SIP with electrical component terminals extending out from encapsulant | OhHan Kim, InSang Yoon | 2019-09-17 |
| 10236337 | Semiconductor device and method of forming substrate including embedded component with symmetrical structure | HyungSang Park, Sungsoo Kim | 2019-03-19 |