Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10438932 | Semiconductor device and method of integrating power module with interposer and opposing substrates | Jinchang ZHOU, Mingjiao Liu | 2019-10-08 |
| 10396028 | Semiconductor package and related methods | Yenting Wen, George Chang | 2019-08-27 |
| 10319652 | Semiconductor package with elastic coupler and related methods | Chee Hiong CHEW, Francis J. Carney | 2019-06-11 |
| 10290672 | Image sensor semiconductor packages and related methods | Larry D. Kinsman, Yu-Te HSIEH, Oswald Skeete, Weng-Jin Wu, Chi-Yao Kuo | 2019-05-14 |
| 10283466 | Polymer resin and compression mold chip scale package | Soon Wei WANG, Chee Hiong CHEW, Francis J. Carney | 2019-05-07 |
| 10231340 | Single reflow power pin connections | Yushuang YAO, Atapol Prajuckamol, Chee Hiong CHEW, Francis J. Carney | 2019-03-12 |
| 10186493 | Semiconductor copper metallization structure and related methods | — | 2019-01-22 |