Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453784 | Semiconductor device and method of forming cantilevered protrusion on a semiconductor die | Michael J. Seddon | 2019-10-22 |
| 10446480 | Through-substrate via structure and method of manufacture | Michael J. Seddon | 2019-10-15 |
| 10319652 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Chee Hiong CHEW | 2019-06-11 |
| 10283466 | Polymer resin and compression mold chip scale package | Yusheng LIN, Soon Wei WANG, Chee Hiong CHEW | 2019-05-07 |
| 10231340 | Single reflow power pin connections | Yushuang YAO, Atapol Prajuckamol, Chee Hiong CHEW, Yusheng LIN | 2019-03-12 |
| 10199316 | Semiconductor device and method of aligning semiconductor wafers for bonding | Michael J. Seddon | 2019-02-05 |