Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10319659 | Semiconductor package and related methods | C H Chew, Yushuang YAO | 2019-06-11 |
| 10231340 | Single reflow power pin connections | Yushuang YAO, Chee Hiong CHEW, Francis J. Carney, Yusheng LIN | 2019-03-12 |
| 10224655 | Flexible press fit pins for semiconductor packages and related methods | Yushuang YAO, Chee Hiong CHEW | 2019-03-05 |
| 10177074 | Flexible semiconductor package | Soon Wei WANG, Hoe Kit Liew How Kat Ley | 2019-01-08 |