Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468304 | Semiconductor substrate production systems and related methods | — | 2019-11-05 |
| 10461000 | Semiconductor wafer and method of probe testing | Heng Chen Lee | 2019-10-29 |
| 10453784 | Semiconductor device and method of forming cantilevered protrusion on a semiconductor die | Francis J. Carney | 2019-10-22 |
| 10446480 | Through-substrate via structure and method of manufacture | Francis J. Carney | 2019-10-15 |
| 10403544 | Semiconductor die singulation methods | — | 2019-09-03 |
| 10388526 | Semiconductor wafer thinning systems and related methods | Thomas Neyer | 2019-08-20 |
| 10199316 | Semiconductor device and method of aligning semiconductor wafers for bonding | Francis J. Carney | 2019-02-05 |
| 10170381 | Semiconductor wafer and method of backside probe testing through opening in film frame | Heng Chen Lee | 2019-01-01 |