Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10290556 | High reliability wafer level semiconductor packaging | — | 2019-05-14 |
| 10290672 | Image sensor semiconductor packages and related methods | Larry D. Kinsman, Yusheng LIN, Oswald Skeete, Weng-Jin Wu, Chi-Yao Kuo | 2019-05-14 |
| 10181487 | High reliability housing for a semiconductor package | — | 2019-01-15 |