Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461059 | Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods | Michel Koopmans, David R. Hembree | 2019-10-29 |
| 10283481 | Device packaging facility and method, and device processing apparatus utilizing DEHT | Jian Zhang, Joshua Pinnolis | 2019-05-07 |
| 10170389 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li +3 more | 2019-01-01 |