Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10461059 | Stacked semiconductor die assemblies with improved thermal performance and associated systems and methods | Michel Koopmans, Shijian Luo | 2019-10-29 |
| 10424495 | Stacked semiconductor die assemblies with high efficiency thermal paths and molded underfill | William R. Stephenson | 2019-09-24 |