Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10504854 | Through-stiffener inerconnects for package-on-package apparatus and methods of assembling same | Bok Eng Cheah, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2019-12-10 |
| 10396047 | Semiconductor package with package components disposed on a package substrate within a footprint of a die | Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong | 2019-08-27 |