Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453795 | Microprocessor package with first level die bump ground webbing structure | Yu Zhang, Mathew J. Manusharow, Kemal Aygun | 2019-10-22 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10453795 | Microprocessor package with first level die bump ground webbing structure | Yu Zhang, Mathew J. Manusharow, Kemal Aygun | 2019-10-22 |