Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515884 | Substrate having a conductive structure within photo-sensitive resin | Tien-Szu Chen, Kuang-Hsiung Chen, Sheng-Ming Wang, Yu-Ying Lee, Chih-Cheng Lee | 2019-12-24 |
| 10497659 | Double plated conductive pillar package substrate | Chih-Cheng Lee | 2019-12-03 |
| 10446515 | Semiconductor substrate and semiconductor packaging device, and method for forming the same | Chih-Cheng Lee | 2019-10-15 |
| 10381296 | Semiconductor device package and a method of manufacturing the same | Chih-Cheng Lee | 2019-08-13 |