Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468381 | Wafer level integration of passive devices | — | 2019-11-05 |
| 10411012 | Multi-die fine grain integrated voltage regulation | Jared L. Zerbe, Emerson S. Fang, Shawn Searles | 2019-09-10 |
| 10290620 | Package with SoC and integrated memory | John Bruno, Timothy J. Millet | 2019-05-14 |
| 10181455 | 3D thin profile pre-stacking architecture using reconstitution method | Chonghua Zhong, Kunzhong Hu, Se Young Yang | 2019-01-15 |