Issued Patents 2019
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10181455 | 3D thin profile pre-stacking architecture using reconstitution method | Jun Zhai, Chonghua Zhong, Se Young Yang | 2019-01-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10181455 | 3D thin profile pre-stacking architecture using reconstitution method | Jun Zhai, Chonghua Zhong, Se Young Yang | 2019-01-15 |