Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10181455 | 3D thin profile pre-stacking architecture using reconstitution method | Jun Zhai, Kunzhong Hu, Se Young Yang | 2019-01-15 |
CZ
Chonghua Zhong
Overall (2019): #504,910 of 560,194Top 95%
1
Patents 2019