Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10521391 | Chip to chip interface with scalable bandwidth | Jafar Savoj, Jose A. Tierno, Sanjeev K. Maheshwari, Brian S. Leibowitz, Pradeep Trivedi +1 more | 2019-12-31 |
| 10411012 | Multi-die fine grain integrated voltage regulation | Jared L. Zerbe, Jun Zhai, Shawn Searles | 2019-09-10 |