Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490516 | Packaged integrated circuit device with cantilever structure | Bilal Khalaf, Sireesha Gogineni, Brian J. Long | 2019-11-26 |
| 10396055 | Method, apparatus and system to interconnect packaged integrated circuit dies | Yong She, Zhicheng Ding, Richard Patten | 2019-08-27 |