Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10490516 | Packaged integrated circuit device with cantilever structure | John G. Meyers, Sireesha Gogineni, Brian J. Long | 2019-11-26 |
| 10475766 | Microelectronics package providing increased memory component density | — | 2019-11-12 |
| 10304814 | I/O layout footprint for multiple 1LM/2LM configurations | Konika Ganguly, Robert J. Royer, Jr., Rebecca Z. Loop, Anthony M. CONSTANTINE | 2019-05-28 |