Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424494 | Chip module with stiffening frame and orthogonal heat spreader | Evan G. Colgan, Yi Pan, Hilton T. Toy | 2019-09-24 |
| 10381276 | Test cell for laminate and method | Sushumna Iruvanti, Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha +3 more | 2019-08-13 |
| 10332813 | Lid attach optimization to limit electronic package warpage | Sushumna Iruvanti, Shidong Li, Kamal K. Sikka, Hilton T. Toy | 2019-06-25 |
| 10249548 | Test cell for laminate and method | Sushumna Iruvanti, Shidong Li, Marek A. Orlowski, David L. Questad, Tuhin Sinha +3 more | 2019-04-02 |
| 10172258 | Cooling structure for electronic boards | Paul F. Bodenweber, Kenneth C. Marston, Kamal K. Sikka, Hilton T. Toy, Randall J. Werner | 2019-01-01 |