Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361471 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Jean-Marc Rollin, J. Robert Reid, David W. Sherrer, Will Stacy, Ken Vanhille +1 more | 2019-07-23 |
| 10193203 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Jean-Marc Rollin, J. Robert Reid, David W. Sherrer, Will Stacy, Ken Vanhille +1 more | 2019-01-29 |