Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10497511 | Multilayer build processes and devices thereof | — | 2019-12-03 |
| 10431521 | Integrated electronic components and methods of formation thereof | Jean-Marc Rollin | 2019-10-01 |
| 10361471 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Jean-Marc Rollin, J. Robert Reid, Will Stacy, Ken Vanhille, J. Marcus Oliver +1 more | 2019-07-23 |
| 10305158 | Three-dimensional microstructures | Jean-Marc Rollin, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner | 2019-05-28 |
| 10257951 | Substrate-free interconnected electronic mechanical structural systems | Ian Hovey, J. Robert Reid, Will Stacy, Ken Vanhille | 2019-04-09 |
| 10193203 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Jean-Marc Rollin, J. Robert Reid, Will Stacy, Ken Vanhille, J. Marcus Oliver +1 more | 2019-01-29 |