Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10361471 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Jean-Marc Rollin, David W. Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver +1 more | 2019-07-23 |
| 10319654 | Integrated chip scale packages | — | 2019-06-11 |
| 10257951 | Substrate-free interconnected electronic mechanical structural systems | Ian Hovey, David W. Sherrer, Will Stacy, Ken Vanhille | 2019-04-09 |
| 10193203 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Jean-Marc Rollin, David W. Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver +1 more | 2019-01-29 |