Issued Patents 2019
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10431521 | Integrated electronic components and methods of formation thereof | David W. Sherrer | 2019-10-01 |
| 10361471 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | J. Robert Reid, David W. Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver +1 more | 2019-07-23 |
| 10310009 | Wafer scale test interface unit and contactors | Rick Thompson, Kenneth Vanhille, Anatoliy O. Boryssenko | 2019-06-04 |
| 10305158 | Three-dimensional microstructures | David W. Sherrer, Kenneth Vanhille, Marcus Oliver, Steven E. Huettner | 2019-05-28 |
| 10193203 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | J. Robert Reid, David W. Sherrer, Will Stacy, Ken Vanhille, J. Marcus Oliver +1 more | 2019-01-29 |