Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10392704 | Coating electronic component | Kenichi Yoshida, Yuhei Horikawa, Atsushi Sato | 2019-08-27 |
| 10374301 | Wiring component | Yuhei Horikawa, Makoto Orikasa, Yoshihiro Kanbayashi, Hirohumi Asou, Kosuke Kunitsuka | 2019-08-06 |
| 10362686 | Lead-free solder and electronic component built-in module | Tsutomu Yasui, Kenichi Kawabata, Tomoko Kitamura | 2019-07-23 |
| 10354973 | Method for producing semiconductor chip | Makoto Orikasa, Hideyuki Seike, Yuhei Horikawa | 2019-07-16 |
| 10354796 | Method for manufacturing planar coil | Yuhei Horikawa, Makoto Orikasa, Yoshihiro Kanbayashi, Hirohumi Asou, Kosuke Kunitsuka | 2019-07-16 |
| 10304779 | Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof | Makoto Orikasa, Yuhei Horikawa, Yoshihiro Kanbayashi | 2019-05-28 |
| 10205250 | Junction structure for an electronic device and electronic device | Kenichi Yoshida, Yuhei Horikawa | 2019-02-12 |