Issued Patents 2019
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10392704 | Coating electronic component | Kenichi Yoshida, Atsushi Sato, Hisayuki Abe | 2019-08-27 |
| 10374301 | Wiring component | Makoto Orikasa, Yoshihiro Kanbayashi, Hisayuki Abe, Hirohumi Asou, Kosuke Kunitsuka | 2019-08-06 |
| 10354796 | Method for manufacturing planar coil | Makoto Orikasa, Yoshihiro Kanbayashi, Hisayuki Abe, Hirohumi Asou, Kosuke Kunitsuka | 2019-07-16 |
| 10354973 | Method for producing semiconductor chip | Makoto Orikasa, Hideyuki Seike, Hisayuki Abe | 2019-07-16 |
| 10304779 | Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof | Makoto Orikasa, Hisayuki Abe, Yoshihiro Kanbayashi | 2019-05-28 |
| 10205250 | Junction structure for an electronic device and electronic device | Kenichi Yoshida, Hisayuki Abe | 2019-02-12 |