Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10374301 | Wiring component | Yuhei Horikawa, Yoshihiro Kanbayashi, Hisayuki Abe, Hirohumi Asou, Kosuke Kunitsuka | 2019-08-06 |
| 10354796 | Method for manufacturing planar coil | Yuhei Horikawa, Yoshihiro Kanbayashi, Hisayuki Abe, Hirohumi Asou, Kosuke Kunitsuka | 2019-07-16 |
| 10354973 | Method for producing semiconductor chip | Hideyuki Seike, Yuhei Horikawa, Hisayuki Abe | 2019-07-16 |
| 10304779 | Electronic component module having a protective film comprising a protective layer and a low reflectivity layer having a rough outer surface and manufacturing method thereof | Yuhei Horikawa, Hisayuki Abe, Yoshihiro Kanbayashi | 2019-05-28 |