Issued Patents 2019
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10448546 | Noise suppression sheet | Takashi Yamada, Miyuki Yanagida, Atsushi Sato | 2019-10-15 |
| 10403582 | Electronic circuit package using composite magnetic sealing material | — | 2019-09-03 |
| 10373917 | Electronic circuit package using conductive sealing material | — | 2019-08-06 |
| 10362686 | Lead-free solder and electronic component built-in module | Tsutomu Yasui, Hisayuki Abe, Tomoko Kitamura | 2019-07-23 |
| 10269727 | Composite magnetic sealing material and electronic circuit package using the same as mold material | — | 2019-04-23 |
| 10269726 | Electronic circuit package | Toshio Hayakawa, Toshiro Okubo | 2019-04-23 |
| 10256194 | Electronic circuit package using composite magnetic sealing material | — | 2019-04-09 |
| 10253395 | Electronic circuit module component | Tsutomu Yasui | 2019-04-09 |
| 10242954 | Electronic circuit package having high composite shielding effect | — | 2019-03-26 |
| 10170431 | Electronic circuit package | Toshio Hayakawa, Toshiro Okubo | 2019-01-01 |