Issued Patents 2019
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10492299 | Electronic assembly that includes a substrate bridge | Hoay Tien Teoh, Jia Yan Go, Jenny Shio Yin Ong | 2019-11-26 |
| 10438882 | Integrated circuit package with microstrip routing and an external ground plane | — | 2019-10-08 |
| 10411001 | Dynamic random access memory (DRAM) mounts | Hoay Tien Teoh | 2019-09-10 |
| 10388636 | Integrating system in package (SIP) with input/output (IO) board for platform miniaturization | Wee Hoe, Khang Choong Yong, Ping Ping Ooi | 2019-08-20 |
| 10356902 | Board to board interconnect | Chee Ling Wong, Wil Choon Song, Khang Choong Yong, Mohd Muhaiyiddin Bin Abdullah, Tin Poay Chuah | 2019-07-16 |
| 10317938 | Apparatus utilizing computer on package construction | Khai Ern See, Damien Weng Kong Chong, Min Suet Lim, Ping Ping Ooi, Chu Aun Lim +6 more | 2019-06-11 |
| 10297541 | Multiple-component substrate for a microelectronic device | Min Suet Lim, Mooi Ling Chang, Say Thong Tony Tan, Tin Poay Chuah | 2019-05-21 |
| 10256213 | Reduced-height electronic memory system and method | Min Suet Lim, Jiun Hann Sir | 2019-04-09 |
| 10256519 | Stranded transmission line and uses thereof | Wil Choon Song, Khang Choong Yong, Min Suet Lim, Boon Ping Koh | 2019-04-09 |