Issued Patents 2019
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515912 | Integrated circuit packages | Min Suet Lim, Jiun Hann Sir, Eng Huat Eh Goh | 2019-12-24 |
| 10297541 | Multiple-component substrate for a microelectronic device | Min Suet Lim, Eng Huat Goh, Say Thong Tony Tan, Tin Poay Chuah | 2019-05-21 |