Issued Patents 2019
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10446443 | Integrated circuit product having a through-substrate-via (TSV) and a metallization layer that are formed after formation of a semiconductor device | Himani Suhag Kamineni, Vimal Kamineni, Maxwell Lippitt | 2019-10-15 |
| 10236263 | Methods and structures for mitigating ESD during wafer bonding | Luke England, Tanya A. Atanasova, Daniel W. Fisher, Sukeshwar Kannan | 2019-03-19 |
| 10187706 | Snap clip fastener assembly | — | 2019-01-22 |
| 10168502 | Fiber cassette and adapter module with slide lock | Ryan J. Grandidge, Normand James Roy, Michael J. Moldoch, James P. Quinn | 2019-01-01 |