Issued Patents 2019
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10388631 | 3D IC package with RDL interposer and related method | — | 2019-08-20 |
| 10381304 | Interconnect structure | Mark W. Kuemerle | 2019-08-13 |
| 10283487 | Methods of forming integrated circuit package with thermally conductive pillar | Kathryn C. Rivera | 2019-05-07 |
| 10236263 | Methods and structures for mitigating ESD during wafer bonding | Tanya A. Atanasova, Daniel M. Smith, Daniel W. Fisher, Sukeshwar Kannan | 2019-03-19 |
| 10224286 | Interconnect structure with adhesive dielectric layer and methods of forming same | Kenneth J. Giewont | 2019-03-05 |
| 10193011 | Method of manufacturing a 3 color LED integrated Si CMOS driver wafer using die to wafer bonding approach | Srinivasa Banna, Deepak Nayak, Rahul Agarwal | 2019-01-29 |
| 10170389 | Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methods | Steven K. Groothuis, Jian Li, Haojun Zhang, Paul A. Silvestri, Xiao Li +3 more | 2019-01-01 |