Issued Patents 2019
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283487 | Methods of forming integrated circuit package with thermally conductive pillar | Luke England | 2019-05-07 |
| 10224262 | Flexible heat spreader lid | Janak G. Patel, David Stone, Samantha Donovan | 2019-03-05 |