Issued Patents 2019
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483217 | Warpage balancing in thin packages | Belgacem Haba, Sangil Lee, Gabriel Z. Guevara, Javier A. Delacruz | 2019-11-19 |
| 10354942 | Staged via formation from both sides of chip | Vage Oganesian, Belgacem Haba, Ilyas Mohammed, Piyush Savalia | 2019-07-16 |
| 10262947 | Active chip on carrier or laminated chip having microelectronic element embedded therein | Vage Oganesian, Ilyas Mohammed, Belgacem Haba, Piyush Savalia | 2019-04-16 |